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(Draft)R4-2103240_WF on FR2 HST_v01.pptx
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2021/02/02 17:46
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144,9 KB
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(Draft)R4-2103240_WF on FR2 HST_v02_QC.pptx
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2021/02/03 2:55
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145,8 KB
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(Draft)R4-2103240_WF on FR2 HST_v03_Samsung.pptx
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2021/02/03 10:55
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146,2 KB
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(Draft)R4-2103240_WF on FR2 HST_v04_HWrf.pptx
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2021/02/03 13:13
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146,6 KB
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(Draft)R4-2103240_WF on FR2 HST_v05.pptx
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2021/02/03 18:48
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146,9 KB
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(Draft)R4-2103240_WF on FR2 HST_v05_clean.pptx
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2021/02/03 18:48
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145,7 KB
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(Draft)R4-2103240_WF on FR2 HST_v06.pptx
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2021/02/04 3:16
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147,2 KB
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(Draft)R4-2103240_WF on FR2 HST_v06_clean.pptx
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2021/02/04 3:16
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145,8 KB
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(Draft)R4-2103328_Summary_141_after_2nd_round_v01.docx
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2021/02/04 8:15
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500,1 KB
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(Draft)R4-2103328_Summary_141_after_2nd_round_v02.docx
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2021/02/04 9:18
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498,7 KB
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Summary_141_2nd_round_v01.docx
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2021/02/01 4:05
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433,4 KB
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Summary_141_2nd_round_v01_QC.docx
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2021/02/01 6:49
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437,7 KB
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Summary_141_2nd_round_v02_QC_Nokia.docx
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2021/02/02 12:46
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459,7 KB
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Summary_141_2nd_round_v03_Nokia_Samsung.docx
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2021/02/02 17:13
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536,8 KB
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Summary_141_2nd_round_v04_Samsung_EAB.docx
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2021/02/02 18:56
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542 KB
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Summary_141_2nd_round_v05_EAB_DCM.docx
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2021/02/03 9:11
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540,9 KB
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Summary_141_2nd_round_v06_DCM_Intel.docx
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2021/02/03 12:48
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545,3 KB
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Summary_141_2nd_round_v07_Intel_ZTE.docx
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2021/02/03 14:20
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576,2 KB
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