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draft R4-2207177 Summary_330_1st round_v00.docx
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2022/02/24 18:13
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225,5 KB
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draft R4-2207177 Summary_330_1st round_v01_Mod.docx
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2022/02/25 2:47
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225,1 KB
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Summary_330_1st round_v01.docx
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2022/02/21 7:58
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112,1 KB
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Summary_330_1st round_v02_SB.docx
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2022/02/22 6:49
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117 KB
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Summary_330_1st round_v03_SB_DCM.docx
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2022/02/22 8:32
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113,7 KB
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Summary_330_1st round_v04_DCM_Nokia.docx
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2022/02/22 14:12
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128,5 KB
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Summary_330_1st round_v05_Nokia_Intel.docx
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2022/02/22 17:32
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135,5 KB
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Summary_330_1st round_v06_Intel_Apple.docx
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2022/02/22 18:42
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143,7 KB
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Summary_330_1st round_v07_Apple_Qualcomm.docx
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2022/02/23 6:12
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149 KB
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Summary_330_1st round_v08_Qualcomm_Ericsson.docx
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2022/02/23 9:52
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159,7 KB
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Summary_330_1st round_v09_Ericsson_MTK.docx
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2022/02/23 10:24
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157 KB
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Summary_330_1st round_v10_MTK_Huawei.docx
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2022/02/23 12:47
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164,6 KB
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Summary_330_1st round_v11_Huawei_Verizon.docx
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2022/02/24 1:07
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163 KB
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Summary_330_1st round_v12_Verizon_ATT.docx
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2022/02/24 4:45
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164,6 KB
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Summary_330_1st round_v13_ATT_Samsung.docx
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2022/02/24 5:49
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178,3 KB
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Summary_330_1st round_v14_Samsung_CMCC.docx
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2022/02/24 6:48
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185,5 KB
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Summary_330_1st round_v15_CMCC_Samsung.docx
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2022/02/24 7:00
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179,6 KB
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