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8.11.1.2
/ 3rd round of email discussion
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R1-211xxxx FL summary for AI 8 11 1 2_v200_FL.docx
2021/11/17 6:01
671,2 KB
R1-211xxxx FL summary for AI 8 11 1 2_v201_FL_DCM.docx
2021/11/17 8:47
685 KB
R1-211xxxx FL summary for AI 8 11 1 2_v202_DCM_MediaTek.docx
2021/11/17 9:13
675,7 KB
R1-211xxxx FL summary for AI 8 11 1 2_v203_MediaTek_Apple.docx
2021/11/17 20:49
693,3 KB
R1-211xxxx FL summary for AI 8 11 1 2_v204_Apple_QC.docx
2021/11/18 1:42
694,1 KB
R1-211xxxx FL summary for AI 8 11 1 2_v205_QC_xiaomi.docx
2021/11/18 3:26
683,4 KB
R1-211xxxx FL summary for AI 8 11 1 2_v206_xiaomi_IDCC.docx
2021/11/18 3:48
700,7 KB
R1-211xxxx FL summary for AI 8 11 1 2_v207_IDCC_vivo.docx
2021/11/18 4:06
691,5 KB
R1-211xxxx FL summary for AI 8 11 1 2_v208_vivo_Pana.docx
2021/11/18 7:49
713,1 KB
R1-211xxxx FL summary for AI 8 11 1 2_v209_Pana_Fujitsu.docx
2021/11/18 8:01
709,4 KB
R1-211xxxx FL summary for AI 8 11 1 2_v210_Fujitsu_Intel.docx
2021/11/18 8:18
722,7 KB
R1-211xxxx FL summary for AI 8 11 1 2_v211_Intel_SS.docx
2021/11/18 9:58
704,3 KB
R1-211xxxx FL summary for AI 8 11 1 2_v212_SS_LGE.docx
2021/11/18 11:22
706,3 KB
R1-211xxxx FL summary for AI 8 11 1 2_v213_LGE_Fraunhofer.docx
2021/11/18 11:49
723,6 KB
R1-211xxxx FL summary for AI 8 11 1 2_v214_Fraunhofer_HWHiSi.docx
2021/11/18 11:59
615,3 KB
R1-211xxxx FL summary for AI 8 11 1 2_v215_HWHiSi_Convida.docx
2021/11/18 16:33
728,1 KB
16 items.