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R4-2306151_Summary_203_1st round_v00.docx
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2023/04/20 16:31
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210,7 KB
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Summary_203_1st round_v00.docx
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2023/04/17 5:53
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118,8 KB
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Summary_203_1st round_v01_LGE.docx
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2023/04/18 3:59
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120,7 KB
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Summary_203_1st round_v02_LGE_Huawei.docx
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2023/04/18 4:09
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131,3 KB
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Summary_203_1st round_v03_Huawei_mtk.docx
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2023/04/18 10:09
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137,2 KB
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Summary_203_1st round_v04_mtk_QC.docx
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2023/04/18 20:48
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144 KB
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Summary_203_1st round_v05_QC_Moderator.docx
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2023/04/18 23:29
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143,9 KB
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Summary_203_1st round_v06_Moderator_Intel.docx
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2023/04/19 4:05
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154,2 KB
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Summary_203_1st round_v07_Intel_Samsung.docx
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2023/04/19 9:50
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186 KB
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Summary_203_1st round_v08_Samsung_Ericsson.docx
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2023/04/19 10:21
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197,6 KB
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Summary_203_1st round_v09_Ericsson.docx
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2023/04/19 10:24
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193,1 KB
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Summary_203_1st round_v10_Ericsson_Nokia.docx
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2023/04/19 10:53
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205,8 KB
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Summary_203_1st round_v11_Nokia_ZTE.docx
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2023/04/19 12:47
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191,7 KB
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Summary_203_1st round_v12_ZTE_Apple.docx
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2023/04/19 23:30
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188,5 KB
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Summary_203_1st round_v13_Apple_Xiaomi.docx
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2023/04/20 2:02
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187,3 KB
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Summary_203_1st round_v14_Xiaomi_vivo.docx
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2023/04/20 2:32
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194,2 KB
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