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[101-e][220] NR_RRM_enh2_3
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R4-2120362 Summary_220_after_2nd_round_v00.docx
2021/11/11 10:04
232 KB
Summary_220_2nd_round_v00.docx
2021/11/08 2:07
177,8 KB
Summary_220_2nd_round_v01_Xiaomi.docx
2021/11/08 9:01
127,8 KB
Summary_220_2nd_round_v02_Xiaomi_QC.docx
2021/11/08 9:11
163,1 KB
Summary_220_2nd_round_v03_QC_Huawei.docx
2021/11/08 12:50
150,8 KB
Summary_220_2nd_round_v04_Huawei_Apple.docx
2021/11/08 15:42
178,4 KB
Summary_220_2nd_round_v05_Apple_ZTE.docx
2021/11/09 3:31
186,2 KB
Summary_220_2nd_round_v06_ZTE_CATT.docx
2021/11/09 6:21
195,8 KB
Summary_220_2nd_round_v07_CATT_CMCC.docx
2021/11/09 7:20
134,7 KB
Summary_220_2nd_round_v08_CMCC_Intel.docx
2021/11/09 8:15
166,6 KB
Summary_220_2nd_round_v09_Intel_Ericsson.docx
2021/11/09 10:33
165,1 KB
Summary_220_2nd_round_v10_Ericsson_MediaTek.docx
2021/11/09 15:04
167,9 KB
Summary_220_2nd_round_v11_MediaTek_DCM.docx
2021/11/10 5:56
164,9 KB
Summary_220_2nd_round_v12_DCM_Nokia.docx
2021/11/10 7:45
173,9 KB
14 items.
