3GPP TDocs (written contributions) at meeting
Meeting: S4-76 - 2013-11-04 to 2013-11-08, Osaka
meeting id: S4-76 (click id for more info on this meeting)Click on the Tdoc to open its file.
TDoc | Title | Source | Remarks |
---|---|---|---|
S4‑131153 | Proposed Meeting Agenda for SA4#76 | SA4 Chairman | - |
S4‑131154 | Proposed Meeting Schedule for SA4#76 | SA4 Chairman | - |
S4‑131155 | Report from SA4 MTSI SWG conf. call #2 on QoS handling for 'SA4 part of End-to-end MTSI extensions' (E2EMTSI) | SA4 MTSI SWG Chairman | - |
S4‑131156 | Proposed Meeting Agenda for MTSI SWG during SA4#76 | SA4 MTSI SWG Chairman | - |
S4‑131157 | Proposed agenda for MBS SWG at SA4#76 | MBS SWG Chairman (Ericsson) | - |
S4‑131158 | Proposed agenda for VIDEO SWG at SA4#76 | VIDEO SWG Chairman | - |
S4‑131159 | Proposed agenda for the SQ SWG meeting during SA4#75 | SQ SWG Chairman | - |
S4‑131160 | Speech quality measurements of LTE terminals under different jitter and packet loss conditions | HEAD acoustics GmbH | - |
S4‑131161 | EVS Selection Test Cross-Check Lab Tasks | Audio Research Labs | - |
S4‑131162 | Proposed Agenda for EVS SWG ad-hoc Meeting #10, 3 Nov 2013, EVS/Joint EVS/SQ SWG Meeting at SA4#76, 4 - 8 Nov | SA4 EVS SWG Chairman | - |
S4‑131163 | Proposed Meeting Schedule for EVS SWG Ad-hoc meeting #10 and EVS SWG meeting at TSG-SA4#76 meeting (for information) | SA4 EVS SWG Chairman | - |
S4‑131164 | CR 26.114-0265 Computation of video b=AS (Release 12) | KT Corp., LG Uplus, SK Telecom, Samsung Electronics Co., Ltd. | - |
S4‑131165 | Draft LS on the handling of QoS parameters between IPv4 and IPv6 systems | Samsung Electronics Co., Ltd. | - |
S4‑131166 | LS on Inclusion of Tools into STL (To: ITU-T SG16) | TSG SA WG4 | - |
S4‑131167 | VoLTE Delay Measurement Results | Intel | - |
S4‑131168 | Accuracy of P.OLQA with inter-measurement delay variation | Intel | - |
S4‑131169 | Proposed Updates on TR 26.827 | Rapporteur (Intel) | - |
S4‑131170 | IMS_SDE: Gap Analysis on Combined PSS and MBMS Download Services | Intel | - |
S4‑131171 | Draft CR 26.237 Combined PSS and MBMS Download Service | Intel | - |
S4‑131172 | IS_DASH: Evaluation Results on QoS Handling for DASH and Proposed Client Adaptation Guidelines | Intel, HuaWei Technologies Co., Ltd, HiSilicon Technologies Co., Lt | - |
S4‑131173 | CR 26.247-0039 rev 1 Registration of MIME Type for QoE Reports (Release 10) | Intel | - |
S4‑131174 | CR 26.247-0040 rev 1 Registration of MIME Type for QoE Reports (Release 11) | Intel | - |
S4‑131175 | CR 26.247-0041 rev 1 Registration of MIME Type for QoE Reports (Release 12) | Intel | - |
S4‑131176 | MI-EMO: Proposed Targeted Content Delivery Framework | Intel | - |
S4‑131177 | Draft CR 26.346 Targeted Content Delivery | Intel | - |
S4‑131178 | Proposed Updates to MI-EMO Work Item Description | Intel | - |
S4‑131179 | MI-EMO: Recommended Requirements and Gap Analysis for Multiple FLUTE Sessions for an MBMS User Service | Qualcomm Incorporated | - |
S4‑131180 | MI-EMO: USD Extensions for DASH-over-MBMS Service Signaling | Qualcomm Incorporated, Telefon AB LM Ericsson, Huawei Technologies Co., Ltd, HiSilicon Technologies Co., Lt | - |
S4‑131181 | CR 26.346-0320 rev 3 USD Indication of DASH Transport (Release 12) | Qualcomm Incorporated, Telefon AB LM Ericsson, Huawei Technologies Co., Ltd, HiSilicon Technologies Co., Lt | - |
S4‑131182 | CR 26.346-0336 rev 2 Datacasting Support (Release 12) | Qualcomm Incorporated, Telefon AB LM Ericsson | POSTPONED |
S4‑131183 | MI-MooD: Recommended Requirements and Gap Analysis | Qualcomm Incorporated, Telefon AB LM Ericsson | - |
S4‑131184 | Editor's Update to TR 26.849, MI-MooD | Rapporteur (Qualcomm Incorporated) | - |
S4‑131185 | CR 26.346-0348 Full File Repair Without FDT (Release 12) | Qualcomm Incorporated, Telefon AB LM Ericsson | - |
S4‑131186 | MI-MooD: Call Flows for Switching from non-eMBMS Service to eMBMS Service Delivered over Broadcast | Qualcomm Incorporated | - |
S4‑131187 | MI-MooD: Call Flows for Switching from Broadcast to Unicast Delivery | Qualcomm Incorporated | - |
S4‑131188 | MI-MooD: Call flows and Gap Analysis for MooD based on Potential MBMS User Service | Qualcomm Incorporated | - |
S4‑131189 | MI-EMO: FLUTE Enhancements - A way forward | Qualcomm Incorporated | - |
S4‑131190 | MI-EMO: Use Cases for Multi-Program Offerings | Qualcomm Incorporated | - |
S4‑131191 | MI-EMO: Generic Application Service Delivery over MBMS - Reference Architecture and Gap Analysis | Qualcomm Incorporated | - |
S4‑131192 | IS-DASH:Consolidated Use Cases on Ad Insertion WITHDRAWN MISSING | Qualcomm Incorporated | - |
S4‑131193 | IS-DASH: Further Considerations on Server and Network-Assisted DASH in 3GPP Architectures | Qualcomm Incorporated | WITHDRAWN MISSING |
S4‑131194 | IS-DASH: Second Edition of MPEG-DASH and relevance for 3GP-DASH | Qualcomm Incorporated | - |
S4‑131195 | IS-DASH: Proposed Editor's Updates to TR 26.938 | Qualcomm Incorporated | - |
S4‑131196 | HTML-5: Considerations on current Technical Report | Qualcomm Incorporated | - |
S4‑131197 | Video: Simulation results for evaluation of HEVC in MTSI and MMS | Qualcomm Incorporated | - |
S4‑131198 | Video: Support of HEVC in MSTI and MMS | Qualcomm Incorporated | - |
S4‑131199 | Video: Draft CR on HEVC support for TS 26.247 | Qualcomm Incorporated, INTERDIGITAL COMMUNICATIONS, Telefon AB LM Ericsson, ORANGE | - |
S4‑131200 | Video: Draft CR on non-HEVC bug fixes for TS 26.247 | Qualcomm Incorporated | - |
S4‑131201 | Video: Draft CR on HEVC support for TS 26.244 | Qualcomm Incorporated, INTERDIGITAL COMMUNICATIONS, Telefon AB LM Ericsson, ORANGE | - |
S4‑131202 | Video: Draft CR on non-HEVC bug fixes for TS 26.244 | Qualcomm Incorporated | - |
S4‑131203 | Video: Draft CR on HEVC support for TS 26.234 | Qualcomm Incorporated, INTERDIGITAL COMMUNICATIONS, Telefon AB LM Ericsson, ORANGE | - |
S4‑131204 | Video: Draft CR on non-HEVC bug fixes for TS 26.234 | Qualcomm Incorporated | - |
S4‑131205 | Video: Draft CR on HEVC support for TS 26.346 | Qualcomm Incorporated, INTERDIGITAL COMMUNICATIONS, Telefon AB LM Ericsson, ORANGE | - |
S4‑131206 | Video: Draft CR on non-HEVC bug fixes for TS 26.346 | Qualcomm Incorporated | - |
S4‑131207 | Video: Draft CR on HEVC support for TS 26.114 | Qualcomm Incorporated, NOKIA Corporation | - |
S4‑131208 | Video: Draft CR on non-HEVC bug fixes for TS 26.114 | Qualcomm Incorporated | WITHDRAWN MISSING |
S4‑131209 | Video: Draft CR on HEVC support for TS 26.140 | Qualcomm Incorporated, NOKIA Corporation | - |
S4‑131210 | Video: Draft CR on non-HEVC bug fixes for TS 26.140 | Qualcomm Incorporated | WITHDRAWN MISSING |
S4‑131211 | CR 26.346-0346 Keep Updated Service (Release 12) | Samsung Electronics Co., Ltd. | WITHDRAWN |
S4‑131212 | CR 26.346-0347 Proxy server-based MooD (Release 12) | Samsung Electronics Co., Ltd. | POSTPONED |
S4‑131213 | HTML5 Profile | Samsung Electronics Co., Ltd. | - |
S4‑131214 | TML5 in eMBMS services | Samsung Electronics Co., Ltd. | - |
S4‑131215 | Transport Protocol for FLUTE+ | Samsung Electronics Co., Ltd. | - |
S4‑131216 | Control commands for DASH Clients | Samsung Electronics Co., Ltd. | - |
S4‑131217 | MI-EMO: Proposed Updates on Mosaic Service | Sony Corporation | - |
S4‑131218 | MI-EMO: On Signaling Fast Zap Video or Mosaic Service | Sony Corporation | - |
S4‑131219 | Report from SA4 SQ SWG conf. call on 15th October 2013 | SA4 SQ SWG Chairman | - |
S4‑131220 | CR 26 234-0215 SDP attribute frame packing type (Release 11) | HuaWei Technologies Co., Ltd | - |
S4‑131221 | CR 26 234-0216 SDP attribute frame packing type (Release 12) | HuaWei Technologies Co., Ltd | - |
S4‑131222 | LS on common IMS procedures | TSG CT WG1 | - |
S4‑131223 | Reply LS on End-to-end QoS handling of MTSI | TSG CT WG1 | - |
S4‑131224 | Reply LS to SA WG4 LS on End-to-end QoS handling of MTSI | TSG CT WG3 | - |
S4‑131225 | LS on End-to-end fixed-mobile interworking | ETSI TC E2NA | - |
S4‑131226 | LS on Applicability of WI MI-MooD to Service Continuity Requirements for Group Communications | TSG SA WG2 | - |
S4‑131227 | Reply LS to CT WG4 LS on new work item on "IMS support for RTP / RTCP transport multiplexing" | TSG SA WG2 | - |
S4‑131228 | LS to 3GPP SA4 on "Transmission requirements for Superwideband handheld (handset and handsfree) terminals" | ETSI TC STQ | - |
S4‑131229 | LS to 3GPP SA4 and DECT on "Acoustic Level in fixed and mobile interworking" | ETSI TC STQ | - |
S4‑131230 | Draft CR to 26.131 on LTE UE delay requirements | Telefon AB LM Ericsson, ORANGE, Qualcomm Incorporated | - |
S4‑131231 | Draft CR to 26.132 on LTE UE delay measurements | Telefon AB LM Ericsson, ORANGE, Qualcomm Incorporated | - |
S4‑131232 | CR 26.233-0008 Missing PSS Server (Release 12) | Telefon AB LM Ericsson | WITHDRAWN |
S4‑131233 | CR 26.346-0349 USD Schema bug fix (Release 11) | Telefon AB LM Ericsson, Qualcomm Incorporated | - |
S4‑131234 | CR 26.346-0350 MSISDN in OMA PUSH Bearer (Release 12) | Telefon AB LM Ericsson | WITHDRAWN |
S4‑131235 | CR 26.247-0045 3GP-DASH MPD Schema fix (Release 10) | Telefon AB LM Ericsson, BlackBerry UK Limited | - |
S4‑131236 | CR 26.247-0046 3GP-DASH MPD Schema fix (Release 11) | Telefon AB LM Ericsson, BlackBerry UK Limited | - |
S4‑131237 | CR 26.247-0047 3GP-DASH MPD Schema fix (Release 12) | Telefon AB LM Ericsson, BlackBerry UK Limited | - |
S4‑131238 | MI-EMO Datacasting Support | Telefon AB LM Ericsson | - |
S4‑131239 | CR 26.114-0266 Correction to number of audio channels (Release 8) | Telefon AB LM Ericsson, Samsung Electronics Co, Ltd., Qualcomm Incorporated, Telecom Italia S.p.A., Intel, ORANGE, HuaWei Technologies Co., Ltd | - |
S4‑131240 | CR 26.114-0267 Correction to number of audio channels (Release 9) | Telefon AB LM Ericsson, Samsung Electronics Co, Ltd., Qualcomm Incorporated, Telecom Italia S.p.A., Intel, ORANGE, HuaWei Technologies Co., Ltd | - |
S4‑131241 | CR 26.114-0268 Correction to number of audio channels (Release 10) | Telefon AB LM Ericsson, Samsung Electronics Co, Ltd., Qualcomm Incorporated, Telecom Italia S.p.A., Intel, ORANGE, HuaWei Technologies Co., Ltd | - |
S4‑131242 | CR 26.114-0263 rev 1 Correction to number of audio channels (Release 11) | Telefon AB LM Ericsson, Samsung Electronics Co, Ltd., Qualcomm Incorporated, Telecom Italia S.p.A., Intel, ORANGE, HuaWei Technologies Co., Ltd | - |
S4‑131243 | CR 26.114-0264 rev 1 Correction to number of audio channels (Release 12) | Telefon AB LM Ericsson, Samsung Electronics Co, Ltd., Qualcomm Incorporated, Telecom Italia S.p.A., Intel, ORANGE, HuaWei Technologies Co., Ltd | - |
S4‑131244 | E2EMTSI project plan v0.2.3 | Rapporteur (Telefon AB LM Ericsson) | - |
S4‑131245 | Draft CR 26.114 E2EMTSI Fixed-mobile interworking, v0.0.3 | Editor (Telefon AB LM Ericsson) | - |
S4‑131246 | Proposal for MGW requirements and recommendations for fixed-mobile interworking | Telefon AB LM Ericsson | - |
S4‑131247 | System description for TR Improved end-to-end QoS handling | Telefon AB LM Ericsson | - |
S4‑131248 | Use cases for TR Improved end-to-end QoS handling, fixed-rate speech codecs | Telefon AB LM Ericsson | - |
S4‑131249 | Use cases for TR Improved end-to-end QoS handling, multi-rate speech codecs | Telefon AB LM Ericsson | WITHDRAWN MISSING |
S4‑131250 | Use cases for TR Improved end-to-end QoS handling, video codecs | Telefon AB LM Ericsson | - |
S4‑131251 | Simulation results for E2EMTSI video rate adaptation | Telefon AB LM Ericsson | - |
S4‑131252 | CR 26.141-0006 Clarification of H.264 profile support requirement (Release 11) | Telefon AB LM Ericsson | - |
S4‑131253 | CR 26.346-0351 Correction to Partial File Delivery from MBMS Receiver to DASH Client (Release 11) | Telefon AB LM Ericsson | - |
S4‑131254 | CR 26.946-0003 Correction to Partial File Delivery from MBMS Receiver to DASH Client (Release 11) | Telefon AB LM Ericsson | - |
S4‑131255 | CR 26.247-0048 Corrections to MPD Delta example (Release 10) | BlackBerry UK Limited, Telefon AB LM Ericsson | - |
S4‑131256 | CR 26.247-0049 Corrections to MPD Delta example (Release 11) | BlackBerry UK Limited, Telefon AB LM Ericsson | - |
S4‑131257 | CR 26.247-0050 Corrections to MPD Delta example (Release 12) | BlackBerry UK Limited, Telefon AB LM Ericsson | - |
S4‑131258 | Draft LS to SA2 on PSS DASH service | HuaWei Technologies Co., Ltd | - |
S4‑131259 | CR 26.944-0001 Correction to references (Release 11) | HuaWei Technologies Co., Ltd | - |
S4‑131260 | Update to MI-EMO working plan and timeline | HuaWei Technologies Co., Ltd | - |
S4‑131261 | Consistent QoE support for DASH service | HuaWei Technologies Co., Ltd | - |
S4‑131262 | DASH delivery over MBMS Architecture | HuaWei Technologies Co., Ltd, HiSilicon Technologies Co., Lt, Qualcomm Incorporated | - |
S4‑131263 | Service class and service type | HuaWei Technologies Co., Ltd | - |
S4‑131264 | Draft CR 26.131 STMR - adaptation to modern form factors | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131265 | Draft CR 26.132 STMR - adaptation to modern form factors | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131266 | Draft report from SA4 EVS SWG Teleconference #31 (17th October 2013) | EVS SWG Secretary (ORANGE) | - |
S4‑131267 | Proposed input for draft CR on end-to-end fixed-mobile interworking | ORANGE | - |
S4‑131268 | Correction on DTMF handling | ORANGE | - |
S4‑131269 | CR 26.114-0269 Clarification of DTMF handling (Release 8) | ORANGE | - |
S4‑131270 | CR 26.114-0270 Clarification of DTMF handling (Release 9) | ORANGE | - |
S4‑131271 | CR 26.114-0271 Clarification of DTMF handling (Release 10) | ORANGE | - |
S4‑131272 | DRAFT CR 26.141 on Video codec alignment to MTSI | Telefon AB LM Ericsson | - |
S4‑131273 | Further Process in EVS Standardization | Fraunhofer IIS, Huawei Technologies Co. Ltd., Nokia Corporation, NTT, NTT DOCOMO Inc., ORANGE, Panasonic Corporation, Qualcomm Incorporated, Samsung Electronics Co. Ltd., Telefon AB LM Ericsson, VoiceAge Corporation, ZTE Corporation | - |
S4‑131274 | Regulatory Issues for MBMS | Rogers Wireless Inc. | - |
S4‑131275 | Draft CR 26.131 ART_LTE-SUPER | Sony Mobile Com. Japan, Inc. | - |
S4‑131276 | Draft CR 26.132 ART_LTE-SUPER | Sony Mobile Com. Japan, Inc. | - |
S4‑131277 | LS on Inclusion of Tools into STL (To: ITU-T SG16) | TSG SA WG4 | - |
S4‑131278 | Liaison response on MPEG-DASH | ISO/IEC JTC 1/SC 29/WG 11 (MPEG) | - |
S4‑131279 | CR 26.346-0348 rev 1 Full File Repair Without FDT (Release 12) | Qualcomm Incorporated, Telefon AB LM Ericsson | - |
S4‑131280 | Further Process in EVS Standardization | Fraunhofer IIS, Huawei Technologies Co. Ltd., Nokia Corporation, NTT, NTT DOCOMO Inc., ORANGE, Panasonic Corporation, Qualcomm Incorporated, Samsung Electronics Co. Ltd., Telefon AB LM Ericsson, VoiceAge Corporation, ZTE Corporation | - |
S4‑131281 | EVS Permanent document (EVS-2): EVS Project plan, v0.5.0 | Editor (HuaWei Technologies Co. Ltd) | - |
S4‑131282 | Proposed structure and organization of the experiments for the EVS Selection Phase | Dynastat Inc., Audio Research Labs, DELTA, Mesaqin s.r.o. (Ltd.) | - |
S4‑131283 | Draft report from EVS SWG Adhoc meeting#10 (3 November 2013) | EVS SWG Secretary (ORANGE) | - |
S4‑131284 | Report from EVS SWG Adhoc meeting#10 (3 November 2013) | EVS SWG Secretary (ORANGE) | - |
S4‑131285 | Draft Reply LS on "Acoustic Level in fixed and mobile interworking" (To: ETSI TC STQ, Cc: ETSI TC DECT) | TSG SA WG4 | - |
S4‑131286 | Draft New Work Item Description on Video Coding Enhancements in IMS Messaging and Presence | Telefon AB LM Ericsson, ORANGE, Intel, Qualcomm Incorporated | - |
S4‑131287 | CR 26 234-0215 rev 1 SDP attribute frame packing type (Release 11) | HuaWei Technologies Co., Ltd | - |
S4‑131288 | CR 26 234-0216 rev 1 SDP attribute frame packing type (Release 12) | HuaWei Technologies Co., Ltd | - |
S4‑131289 | TR 26.906 Evaluation of HEVC for 3GPP Services (Release 12) v0.3.0 | Qualcomm Incorporated (Rapporteur) | - |
S4‑131290 | Revised WID on High Efficiency Video Coding (HEVC) | Qualcomm, NTT DOCOMO, NOKIA, TelefonABLMEricsson, ST-Ericsson, Cisco Belgium, Fraunhofer, InterDigital, ORANGE, Nomor, Verizon, DeutscheTelekom AG, Huawei, HiSilicon | - |
S4‑131291 | Updated HEVC Time plan | Qualcomm Incorporated (Rapporteur) | - |
S4‑131292 | Video: Draft CR on HEVC support for TS 26.244 | Qualcomm Incorporated | - |
S4‑131293 | CR 26.244-0051 Editorial and technical corrections (Release 12) | Qualcomm Incorporated | - |
S4‑131294 | CR 26.234-0217 Editorial and technical corrections (Release 12) | Qualcomm Incorporated | - |
S4‑131295 | CR 26.346-0352 Editorial and technical corrections (Release 12) | Qualcomm Incorporated | - |
S4‑131296 | CR 26 234-0215 rev 2 SDP attribute frame packing type (Release 11) | HuaWei Technologies Co., Ltd | - |
S4‑131297 | New Work Item Description on Video Coding Enhancements in IMS Messaging and Presence | Telefon AB LM Ericsson, ORANGE, Intel, Qualcomm Incorporated, Huawei Technologies Co., Ltd., NOKIA Corporation | - |
S4‑131298 | Video SWG report during SA4#76 | Video SWG Chairman | - |
S4‑131299 | EVS Permanent document (EVS-2): EVS Project plan, v0.5.1 | Editor (HuaWei Technologies Co. Ltd) | - |
S4‑131300 | Proposed Update to MI-EMO working plan and timeline | Qualcomm Incorporated | - |
S4‑131301 | CR 26.114-0270 rev 1 Clarification of DTMF handling (Release 9) | ORANGE | - |
S4‑131302 | CR 26.114-0271 rev 1 Clarification of DTMF handling (Release 10) | ORANGE | - |
S4‑131303 | CR 26.114-0272 E2EMTSI Fixed-mobile interworking | Telefon AB LM Ericsson | - |
S4‑131304 | LS on fixed-mobile interworking (To: 3GPP TSG CT WG1, 3GPP TSG CT WG3, 3GPP TSG CT WG4, ETSI E2NA, ETSI TC NTECH, ETSI TC DECT, ETSI SC EMTEL, CableLabs, 3GPP2 TSG-SX, 3GPP2 TSG-AC, Cc:-) | TSG SA WG4 | - |
S4‑131305 | CR 26.114-0265 rev 1 Computation of video b=AS (Release 12) | KT Corp., LG Uplus, SK Telecom, Samsung Electronics Co., Ltd. | - |
S4‑131306 | Draft LS on the handling of QoS parameters between IPv4 and IPv6 systems (To: TSG CT WG1, TSG CT WG3) | Samsung Electronics Co., Ltd. | - |
S4‑131307 | TR 26.9de Study on improved end-to-end QoS handling, v0.0.1 | Telefon AB LM Ericsson | - |
S4‑131308 | LS on improved End-to-end QoS handling of MTSI (To: 3GPP TSG SA WG2, 3GPP TSG CT WG1, 3GPP TSG CT WG3, 3GPP TSG CT WG4) | Telefon AB LM Ericsson | - |
S4‑131309 | Reply LS on new work item on "IMS support for RTP / RTCP transport multiplexing" (To: 3GPP TSG CT WG4, 3GPP TSG SA WG2, Cc: 3GPP SA WG3, 3GPP TSG CT WG1, 3GPP TSG CT WG3) | Telefon AB LM Ericsson | - |
S4‑131310 | E2EMTSI project plan v0.3.0 | Rapporteur (Telefon AB LM Ericsson) | - |
S4‑131311 | Draft Report of the MTSI SWG meeting held during SA4#76 | SA4 MTSI SWG Acting Secretary | - |
S4‑131312 | Reply LS on "Acoustic Level in fixed and mobile interworking" (To: ETSI TC STQ, Cc: ETSI TC DECT) | TSG SA WG4 | - |
S4‑131313 | TR 26.906 Evaluation of HEVC for 3GPP Services (Release 12) v0.3.0 | Qualcomm Incorporated (Rapporteur) | - |
S4‑131314 | Updated HEVC Time plan | Qualcomm Incorporated (Rapporteur) | - |
S4‑131315 | LS on the handling of QoS parameters between IPv4 and IPv6 systems (To: TSG CT WG1, TSG CT WG3) | Samsung Electronics Co., Ltd. | - |
S4‑131316 | CR 26.244-0051 rev 1 Editorial and technical corrections (Release 12) | Qualcomm Incorporated | - |
S4‑131317 | Revised WID on High Efficiency Video Coding (HEVC) | Qualcomm, NTT DOCOMO, NOKIA, TelefonABLMEricsson, ST-Ericsson, Cisco Belgium, Fraunhofer, InterDigital, ORANGE, Nomor, Verizon, DeutscheTelekom AG, Huawei, HiSilicon | - |
S4‑131318 | LS Response on Applicability of WI MI-MooD to Service Continuity Requirements for Group Communications (To: SA2) | MI-MooD Rapporteur (Qualcomm Incorporated) | - |
S4‑131319 | MBS SWG Report at SA4#76 | Chairman (Ericsson) | - |
S4‑131320 | LS on the UE capabilities regarding support of simultaneous MBMS bearer reception (To: SA2, RAN1, RAN2) | TSG SA WG4 | - |
S4‑131321 | MI-EMO: USD Extensions for DASH-over-MBMS Service Signaling | Qualcomm Incorporated, Telefon AB LM Ericsson, Huawei Technologies Co., Ltd, HiSilicon Technologies Co., Ltd | - |
S4‑131322 | CR 26.346-0320 rev 4 USD Indication of DASH Transport (Release 12) | Qualcomm Incorporated, Telefon AB LM Ericsson, Huawei Technologies Co., Ltd, HiSilicon Technologies Co., Ltd | - |
S4‑131323 | CR 26.247-0045 rev 1 3GP-DASH MPD Schema fix (Release 10) | Telefon AB LM Ericsson, BlackBerry UK Limited | - |
S4‑131324 | CR 26.247-0046 rev 1 3GP-DASH MPD Schema fix (Release 11) | Telefon AB LM Ericsson, BlackBerry UK Limited | - |
S4‑131325 | CR 26.247-0047 rev 1 3GP-DASH MPD Schema fix (Release 12) | Telefon AB LM Ericsson, BlackBerry UK Limited | - |
S4‑131326 | Draft TR 26.827 on "IMS-based Streaming and Download Delivery Enhancements" (IMS_SDE) (Release 12), v. 0.3.0 | Rapporteur (Intel) | - |
S4‑131327 | CR 26.233-0009 Missing PSS Server (Release 10) | Telefon AB LM Ericsson | - |
S4‑131328 | CR 26.233-0010 Missing PSS Server (Release 11) | Telefon AB LM Ericsson | - |
S4‑131329 | LS Response on Applicability of WI MI-MooD to Service Continuity Requirements for Group Communications (To: SA2) | MI-MooD Rapporteur (Qualcomm Incorporated) | - |
S4‑131330 | Draft TR 26.827 on "IMS-based Streaming and Download Delivery Enhancements" (Release 12), v. 0.3.0v0.3.0 | Rapporteur (Intel) | - |
S4‑131331 | CR 26.237-0084 Combined PSS and MBMS Download Service (Release 12) | Intel | - |
S4‑131332 | Proposed Updates to MI-EMO Work Item Description | Intel | - |
S4‑131333 | TR 26.848 v0.6.0 | Editor (HuaWei Technologies Co.) | - |
S4‑131334 | CR 26.346-0320 rev 5 USD Indication of DASH Transport (Release 12) | Qualcomm Incorporated, Telefon AB LM Ericsson, Huawei Technologies Co., Ltd, HiSilicon Technologies Co., Ltd | - |
S4‑131335 | MI-EMO: Proposed Updates on Mosaic Service | Sony Corporation | - |
S4‑131336 | CR 26.346-0348 rev 2 Full File Repair Without FDT (Release 12) | Qualcomm Incorporated, Telefon AB LM Ericsson | - |
S4‑131337 | Draft LS to SA1 on LS on Clarifications on service requirements of MBMS on demand (To: SA1) | Huawei Technologies Co. | - |
S4‑131338 | TR 26.849 v0.4.0, MI-MooD | Rapporteur (Qualcomm Incorporated) | - |
S4‑131339 | MI-MooD: Recommended Requirements and Gap Analysis | Qualcomm Incorporated, Telefon AB LM Ericsson | - |
S4‑131340 | LS reply to SA2 on Applicability of WI MI-MooD for Group Communications | MI-MooD Rapporteur (Qualcomm Incorporated) | - |
S4‑131341 | IS_DASH: Evaluation Results on QoS Handling for DASH and Proposed Client Adaptation Guidelines | Intel, HuaWei Technologies Co., Ltd, HiSilicon Technologies Co., Lt | - |
S4‑131342 | Reply LS to MPEG (ISO/IEC JTC1/SC29/WG11) on MPEG-DASH | Qualcomm Incorporated | - |
S4‑131343 | HTML5 Profile | Samsung Electronics Co., Ltd. | - |
S4‑131344 | HTML5 in eMBMS services | Samsung Electronics Co., Ltd. | - |
S4‑131345 | MI-MooD: Call Flows for Switching from Broadcast to Unicast Delivery | Qualcomm Incorporated | - |
S4‑131346 | MI-MooD: Call flows and Gap Analysis for MooD based on Potential MBMS User Service | Qualcomm Incorporated | - |
S4‑131347 | MI-EMO Datacasting Support | Telefon AB LM Ericsson | - |
S4‑131348 | CR 26.346-0320 rev 6 USD Indication of DASH Transport (Release 12) | Qualcomm Incorporated, Telefon AB LM Ericsson, Huawei Technologies Co., Ltd, HiSilicon Technologies Co., Ltd | - |
S4‑131349 | CR 26.233-0009 rev 1 Missing PSS Server (Release 10) | Telefon AB LM Ericsson | - |
S4‑131350 | CR 26.233-0010 rev 1 Missing PSS Server (Release 11) | Telefon AB LM Ericsson | - |
S4‑131351 | Estimation of CMW500 network simulator delay in loopback mode | Qualcomm Incorporated | - |
S4‑131352 | Draft TR 26.931 Study of Enhanced Acoustic Test Specifications (FS_SEATS), v. 0.0.1 | Rapporteur (Audience Inc.) | - |
S4‑131353 | Liaison statement to 3GPP SA4 on referencing MPEG standards | ISO/IEC JTC1/SC29/WG11 (MPEG) | - |
S4‑131354 | Liaison template on MPEG-DASH | ISO/IEC JTC1/SC29/WG11 (MPEG) | - |
S4‑131355 | Liaison Template on Request for Test Vectors | ISO/IEC JTC1/SC29/WG11 (MPEG) | - |
S4‑131356 | Reply LS on fixed-mobile interworking and text telephony for fixed devices (S4-131100) | ETSI EMTEL | - |
S4‑131357 | CR 26.131-0058 STMR - adaptation to modern form factors (Release 9) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131358 | CR 26.131-0059 STMR - adaptation to modern form factors (Release 10) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131359 | CR 26.131-0060 STMR - adaptation to modern form factors (Release 11) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131360 | CR 26.131-0061 STMR - adaptation to modern form factors (Release 12) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131361 | CR 26.132-0064 STMR - adaptation to modern form factors (Release 9) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131362 | CR 26.132-0065 STMR - adaptation to modern form factors (Release 10) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131363 | CR 26.132-0066 STMR - adaptation to modern form factors (Release 11) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131364 | CR 26.132-0067 STMR - adaptation to modern form factors (Release 12) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131365 | Draft CR to 26.131 on LTE UE delay requirements | Telefon AB LM Ericsson, ORANGE, Qualcomm Incorporated, AT&T | - |
S4‑131366 | Draft CR to 26.132 on LTE UE delay measurements | Telefon AB LM Ericsson, ORANGE, Qualcomm, Incorporated, AT&T, Sony Mobile Com. Japan, Inc. | - |
S4‑131367 | CR 26.132-0068 Updates of LTE radio conditions for acoustic testing (Release 12) | Sony Mobile Com. Japan, Inc., Qualcomm Incorporated | - |
S4‑131368 | Draft CR to 26.131 on LTE UE delay requirements | Telefon AB LM Ericsson, ORANGE, Qualcomm Incorporated, AT&T, Sony Mobile Com. Japan, Inc. | - |
S4‑131369 | ART_LTE-UED-1 Project Plan of ART_LTE-UED work item building block, version 0.0.7 | ART_LTE-UED WI Rapporteurs (AT&T, ORANGE) | - |
S4‑131370 | ART_LTE-NBWB-1 Project Plan of ART_LTE-NBWB work item building block, version 1.0 | ART_LTE-NBWB WI Rapporteur (Sony Mobile Com. Japan, Inc.) | - |
S4‑131371 | ART_LTE-SUPER-1 Project Plan of ART_LTE-SUPER work item building block, version 0.0.6 | ART_LTE-SUPER WI Rapporteur (Sony Mobile Com. Japan, Inc.) | - |
S4‑131372 | On EVS Selection Testing Matters | Joint EVS-SQ Drafting Group | - |
S4‑131373 | CR 26.131-0058 rev 1 STMR - adaptation to modern form factors (Release 9) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131374 | CR 26.131-0059 rev 1 STMR - adaptation to modern form factors (Release 10) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131375 | CR 26.131-0060 rev 1 STMR - adaptation to modern form factors (Release 11) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131376 | CR 26.131-0061 rev 1 STMR - adaptation to modern form factors (Release 12) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131377 | CR 26.132-0064 rev 1 STMR - adaptation to modern form factors (Release 9) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131378 | CR 26.132-0065 rev 1 STMR - adaptation to modern form factors (Release 10) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131379 | CR 26.132-0066 rev 1 STMR - adaptation to modern form factors (Release 11) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131380 | CR 26.132-0067 rev 1 STMR - adaptation to modern form factors (Release 12) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131381 | Revised WID on Enhanced MBMS Operation (MI-EMO) | Intel | - |
S4‑131382 | Draft Reply LS to MPEG (ISO/IEC JTC1/SC29/WG11) on MPEG-DASH | Qualcomm Incorporated | - |
S4‑131383 | TR 26.938 v1.5.0 IS-DASH | Qualcomm Incorporated | - |
S4‑131384 | TR 26.abc FS_HTML5 | Editor (Samsung) | - |
S4‑131385 | CR 26.346-0320 rev 7 USD Indication of DASH Transport (Release 12) | Qualcomm Incorporated, Telefon AB LM Ericsson, Huawei Technologies Co., Ltd, HiSilicon Technologies Co., Ltd | - |
S4‑131386 | MI-MooD: Call flows and Gap Analysis for MooD based on Potential MBMS User Service | Qualcomm Incorporated | - |
S4‑131387 | Reply LS to MPEG (ISO/IEC JTC1/SC29/WG11) on MPEG-DASH | Qualcomm Incorporated | - |
S4‑131388 | MI-MooD: Recommended Requirements and Gap Analysis | Qualcomm Incorporated, Telefon AB LM Ericsson | - |
S4‑131389 | MBS SWG Report at SA4#76 | Chairman (Ericsson) | - |
S4‑131390 | Draft report from SA4#76 EVS SWG | EVS SWG Secretary (ORANGE) | - |
S4‑131391 | CR 26.132-0068 rev 1 Updates of LTE radio conditions for acoustic testing (Release 12) | Sony Mobile Com. Japan, Inc., Qualcomm Incorporated | - |
S4‑131392 | Draft CR to 26.132 on LTE UE delay measurements | Telefon AB LM Ericsson, ORANGE, Qualcomm, Incorporated, AT&T, Sony Mobile Com. Japan, Inc. | - |
S4‑131393 | CR 26.132-0064 rev 2 STMR - adaptation to modern form factors (Release 9) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131394 | CR 26.132-0065 rev 2 STMR - adaptation to modern form factors (Release 10) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131395 | CR 26.132-0066 rev 2 STMR - adaptation to modern form factors (Release 11) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131396 | CR 26.132-0067 rev 2 STMR - adaptation to modern form factors (Release 12) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131397 | CR 26.131-0058 rev 2 STMR - adaptation to modern form factors (Release 9) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131398 | CR 26.131-0059 rev 2 STMR - adaptation to modern form factors (Release 10) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131399 | CR 26.131-0060 rev 2 STMR - adaptation to modern form factors (Release 11) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131400 | CR 26.131-0061 rev 2 STMR - adaptation to modern form factors (Release 12) | Sony Mobile Com. Japan, Inc., Samsung Electronics Co., Ltd | - |
S4‑131401 | ART_LTE-SUPER-1 Project Plan of ART_LTE-SUPER work item building block, version 0.0.7 | ART_LTE-SUPER WI Rapporteur (Sony Mobile Com. Japan, Inc.) | - |
S4‑131402 | TR 26.938 v1.5.1 IS-DASH | Qualcomm Incorporated | - |
S4‑131403 | CR 26.346-0320 rev 8 USD Indication of DASH Transport (Release 12) | Qualcomm Incorporated, Telefon AB LM Ericsson, Huawei Technologies Co., Ltd, HiSilicon Technologies Co., Ltd | - |
S4‑131404 | LS to SA1 on LS on Clarifications on service requirements of MBMS on demand (To: SA1) | Huawei Technologies Co. | - |
S4‑131405 | Reply LS on MPEG-DASH (To: MPEG (ISO/IEC JTC1/SC29/WG11) | Qualcomm Incorporated | - |
S4‑131406 | LS on the UE capabilities regarding support of simultaneous MBMS bearer reception (To: SA2, RAN1, RAN2) | TSG SA WG4 | - |
S4‑131407 | Draft Report of SA4#76 meeting, v. 0.0.1 | TSG-S4 Secretary | - |
page generated from database: 2024-04-13 13:51:47